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SEMATECH Technologists Demonstrate Breakthrough Process Solutions For Extending Advanced Memory and Logic Technologies

2012-05-07

HSINCHU, Taiwan ---- SEMATECH experts reported on innovative approaches to realize advanced CMOS logic and memory device technologies and 3D through-silicon via (TSV) manufacturing at the International VLSI Technology, System and Applications Symposium (VLSI-TSA) on April 23-25, 2012.

Today nearly all electronic devices are built on complementary metal-oxide semiconductor (CMOS) technology. For over half a century, silicon-based materials have been the basic layers used in the manufacturing of CMOS tran......

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